Sponsors

Organizer

Co-Organizer

    No Record!

Technical Co-sponsors

    No Record!

Committee

Honorary Chairs:

Prof. Toshio Fukuda, IEEE President 2020, Japan
Prof. Jun Zhang, President of Beijing Institute of Technology, China

Prof. Erke Mao, Academician of Chinese Academy of Engineering, China


General Chair:

Prof. Teng Long, Vice President of Beijing Institute of Technology, China


Technical Program Committee Chair:

Prof. Xiaopeng Yang, Beijing Institute of Technology, China


Technical Program Committee Co-Chairs:

Prof. Zegang Ding, Beijing Institute of Technology, China

Prof. Chenwei Deng, Beijing Institute of Technology, China


Publication Committee Chair:

Prof. Mengqi Zhou, Chinese Institute of Electronics, China

Important dates

Paper Submission Deadline:
30 April 2019
Extend to 31 May 2019
Paper Acceptance Notification:
15 July 2019
Camera-ready Paper Submission:
15 August 2019
Registration open date:
1 July 2019
Conference Date:
11-13 December, 2019

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IEEE ICSIDP 2019

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